This paper uses finite element simulation to study the influence of the area, thickness and material of the substrate on the solder layer of the power module under a random vibration environment. The results show that as the area of the substrate increases, the thickness decreases, and the density increases, the solder layer stress increases and it is more prone to failure. In addition, the influence of random vibration on the power module is studied under the premise of thermal load. It is found that the thermal load will make the influence of random vibration on the solder layer smaller.
 

Vibration,Thermal Vibration Coupling,Power Module